• DocumentCode
    2506733
  • Title

    Closed-form expressions for the line parameters of co-planar on-chip interconnects on lossy silicon substrates

  • Author

    Luoh, Amy ; Weisshaar, Andreas

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA
  • fYear
    2002
  • fDate
    21-23 Oct. 2002
  • Firstpage
    341
  • Lastpage
    344
  • Abstract
    This paper describes a complete modeling methodology for obtaining closed-form expressions for the frequency-dependent R, L, G, C line parameters of coplanar-type on-chip interconnects on lossy silicon substrates. The frequency-dependent series impedance parameters are obtained using a complex image method to take into account the effects of eddy-currents in the substrate. The frequency-dependent shunt admittance parameters are derived in terms of low- and high-frequency asymptotic static solutions of the equivalent circuit model combined with the complex image method. The proposed closed-from expressions are shown to be in good agreement with full-wave electromagnetic solutions and measurement data.
  • Keywords
    coplanar transmission lines; coplanar waveguides; eddy currents; electric admittance; elemental semiconductors; equivalent circuits; integrated circuit interconnections; integrated circuit modelling; silicon; substrates; transmission line theory; CPW lines; HF asymptotic static solutions; LF asymptotic static solutions; Si; closed-form expressions; complex image method; coplanar waveguide lines; coplanar-type on-chip interconnects; equivalent circuit model; frequency-dependent line parameters; frequency-dependent shunt admittance parameters; lossy Si substrates; modeling methodology; substrate eddy-currents; Admittance; Closed-form solution; Equivalent circuits; Frequency; Impedance; Inductance; Integrated circuit interconnections; Integrated circuit modeling; Metallization; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 2002 IEEE 11th Topical Meeting on
  • Conference_Location
    Monterey, CA, USA
  • Print_ISBN
    0-7803-7451-7
  • Type

    conf

  • DOI
    10.1109/EPEP.2002.1057946
  • Filename
    1057946