Title :
Closed-form expressions for the line parameters of co-planar on-chip interconnects on lossy silicon substrates
Author :
Luoh, Amy ; Weisshaar, Andreas
Author_Institution :
Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA
Abstract :
This paper describes a complete modeling methodology for obtaining closed-form expressions for the frequency-dependent R, L, G, C line parameters of coplanar-type on-chip interconnects on lossy silicon substrates. The frequency-dependent series impedance parameters are obtained using a complex image method to take into account the effects of eddy-currents in the substrate. The frequency-dependent shunt admittance parameters are derived in terms of low- and high-frequency asymptotic static solutions of the equivalent circuit model combined with the complex image method. The proposed closed-from expressions are shown to be in good agreement with full-wave electromagnetic solutions and measurement data.
Keywords :
coplanar transmission lines; coplanar waveguides; eddy currents; electric admittance; elemental semiconductors; equivalent circuits; integrated circuit interconnections; integrated circuit modelling; silicon; substrates; transmission line theory; CPW lines; HF asymptotic static solutions; LF asymptotic static solutions; Si; closed-form expressions; complex image method; coplanar waveguide lines; coplanar-type on-chip interconnects; equivalent circuit model; frequency-dependent line parameters; frequency-dependent shunt admittance parameters; lossy Si substrates; modeling methodology; substrate eddy-currents; Admittance; Closed-form solution; Equivalent circuits; Frequency; Impedance; Inductance; Integrated circuit interconnections; Integrated circuit modeling; Metallization; Silicon;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2002 IEEE 11th Topical Meeting on
Conference_Location :
Monterey, CA, USA
Print_ISBN :
0-7803-7451-7
DOI :
10.1109/EPEP.2002.1057946
