• DocumentCode
    250674
  • Title

    Patch antenna on a thick resin layer fed by coaxial-lines through a hole in a silicon chip in the 60GHz band

  • Author

    Oikawa, Naoya ; Hirokawa, Jiro ; Nakano, Hisamatsu ; Hirachi, Yasutake ; Ando, Makoto

  • Author_Institution
    Dept. of Electr. & Electron. Eng., Tokyo Inst. of Technol., Tokyo, Japan
  • fYear
    2014
  • fDate
    2-5 Dec. 2014
  • Firstpage
    225
  • Lastpage
    226
  • Abstract
    We have proposed to place a CMOS RF circuit and an antenna on each side of a silicon chip in the 60 GHz band, respectively, and to connect between them with low loss by a coaxial-line structure using a hole opening in the chip. To enhance the radiation efficiency, a patch antenna is placed on a thick resin layer. In this paper, we design a differential-feed square patch antenna on a silicon chip.
  • Keywords
    CMOS integrated circuits; coaxial cables; microstrip antennas; millimetre wave antennas; CMOS RF circuit; coaxial-line structure; differential-feed square patch antenna; frequency 60 GHz; silicon chip; thick resin layer; Antenna radiation patterns; CMOS integrated circuits; Patch antennas; Reflection; Resins; Silicon; 60 GHz band; coaxial-line feeding; differential antenna; millimeter wave; patch antenna; silicon chip; thick resin layer;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Antennas and Propagation (ISAP), 2014 International Symposium on
  • Conference_Location
    Kaohsiung
  • Type

    conf

  • DOI
    10.1109/ISANP.2014.7026612
  • Filename
    7026612
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=250674