TOPLine: a delay-pole-residue method for the simulation of lossy and dispersive interconnects

Author

Grivet-Talocia, S. ; Canavero, F.G.

Author_Institution

Dipt. Elettronica, Politecnico di Torino, Italy

fYear

2002

fDate

21-23 Oct. 2002

Firstpage

359

Lastpage

362

Abstract

This paper presents a modeling technique for lossy frequency-dependent multiconductor transmission lines. The main algorithm involves rational approximations combined with modal delay extraction. The transient results obtained for three benchmark cases are reported and compared to reference solutions.

Keywords

SPICE; circuit simulation; delays; equivalent circuits; integrated circuit packaging; interconnections; multiconductor transmission lines; poles and zeros; printed circuits; rational functions; transient analysis; transmission line theory; SPICE-ready equivalent circuits; TOPLine lossy/dispersive interconnect simulation; delay-pole-residue simulation methods; frequency-dependent multiconductor transmission lines; modal delay extraction; rational approximations; transient analysis; Circuit simulation; Delay; Dielectric losses; Dispersion; Frequency domain analysis; Integrated circuit interconnections; Multiconductor transmission lines; Power system transients; Transient analysis; Transmission line matrix methods;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2002 IEEE 11th Topical Meeting on

Conference_Location

Monterey, CA, USA

Print_ISBN

0-7803-7451-7

Type

conf

DOI

10.1109/EPEP.2002.1057950

Filename

1057950