Title :
Thermal design in the open compute datacenter
Author :
Frachtenberg, Eitan ; Lee, Dan ; Magarelli, Marco ; Mulay, Veerendra ; Park, Jay
Author_Institution :
Facebook Inc., Menlo Park, CA, USA
fDate :
May 30 2012-June 1 2012
Abstract :
The advent of Web-based services and cloud computing has instigated an explosive growth in demand for datacenters. Traditionally, Internet companies would lease datacenter space and servers from vendors that often emphasize flexibility over efficiency. But as these companies grew larger, they sought to reduce acquisition and operation costs by building their own datacenters. Facebook reached this stage earlier in 2011 when it unveiled its first customized datacenter in Prineville, Oregon. In designing this datacenter, Facebook took a blank-slate approach where all aspects were rethought for maximum efficiency. Although the resulting datacenter is optimized for Facebook´s workload, it is general enough to be appeal to a wide variety of applications. This paper describes our choices and innovations in the thermal design of the datacenter building, which employs 100% outside-air economization. The efficiency of this design is manifest in an average infrastructure energy use reduction of 86% compared to leased space, and an overall energy use reduction of 29%. This reduction in turn translates to a power usage efficiency of 1.08, measured over the summer of 2011.
Keywords :
building management systems; computer centres; cooling; energy conservation; power engineering computing; structural engineering; thermal engineering; Facebook; Internet companies; Web-based service; blank-slate approach; cloud computing; datacenter building; datacenter cooling; infrastructure energy use reduction; open compute datacenter; outside-air economization; power usage efficiency; thermal design; Context; Facebook; Fans; Heating; Meteorology; Proposals; Waste heat; Air Economization; Datacenter Cooling; Thermal Design;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-9533-7
Electronic_ISBN :
1087-9870
DOI :
10.1109/ITHERM.2012.6231476