Title :
Fast thermal simulations of vertically integrated circuits (3D ICs) including thermal vias
Author :
Ziabari, Amirkoushyar ; Shakouri, Ali
Author_Institution :
Univ. of California Santa Cruz (UCSC), Santa Cruz, CA, USA
fDate :
May 30 2012-June 1 2012
Abstract :
A fast convolution-based technique, deemed Power Blurring, is demonstrated for thermal analysis of 3D ICs, including thermal vias. The temperature resulting from any power may in each layer of the chip can be computed without the need to re-mesh the whole structure. The maximum error in estimation time is reduced by a factor of 76× compared to finite element software.
Keywords :
thermal analysis; three-dimensional integrated circuits; 3D IC; convolution-based technique; estimation time; finite element software; power blurring; thermal analysis; thermal simulation; thermal vias; vertically integrated circuits; Abstracts; Facsimile; Finite element methods; Heating; Integrated circuits; Silicon; Thermal analysis; 3D IC; Fast Thermal Simulation; Power Blurring Method; Thermal Via;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-9533-7
Electronic_ISBN :
1087-9870
DOI :
10.1109/ITHERM.2012.6231482
