• DocumentCode
    2507132
  • Title

    Leading indicator based assessment of operational readiness in electronics subjected to multiple environments

  • Author

    Lall, Pradeep ; Harsha, Mahendra ; Goebel, Kai ; Jones, Jim ; Suhling, Jeff

  • Author_Institution
    Dept. of Mech. Eng., Auburn Univ., Auburn, AL, USA
  • fYear
    2012
  • fDate
    May 30 2012-June 1 2012
  • Firstpage
    639
  • Lastpage
    653
  • Abstract
    Field deployed electronics may accrue damage due to environmental exposure and usage after finite period of service but may not often have any macro-indicators of failure such as cracks or delamination. A method to interrogate the damage state of field deployed electronics in the pre-failure space may allow insight into the damage initiation, progression, and remaining useful life of the deployed system. Aging has been previously shown to effect the reliability and constitutive behavior of second-level leadfree interconnects. Prognostication of accrued damage and assessment of residual life can provide valuable insight into impending failure. In this paper, field deployed parts have been extracted and prognosticated for accrued damage and remaining useful life in an anticipated future deployment environment. A subset of the field deployed parts have been tested to failure in the anticipated field deployed environment to validate the assessment of remaining useful life. In addition, some parts have been subjected to additional know thermo-mechanical stresses and the incremental damage accrued validated with respect to the amount of additional damage imposed on the assemblies. The presented methodology uses leading indicators of failure based on micro-structural evolution of damage to identify accrued damage in electronic systems subjected to sequential stresses of thermal aging and thermal cycling. Damage equivalency methodologies have been developed to map damage accrued in thermal aging to the reduction in thermo-mechanical cyclic life based on damage proxies. The expected error with interrogation of system state and assessment of residual life has been quantified. Prognostic metrics including α-λ metric, sample standard deviation, mean square error, mean absolute percentage error, average bias, relative accuracy, and cumulative relative accuracy have been used to compare the performance of the damage proxies.
  • Keywords
    ageing; ball grid arrays; failure analysis; heat sinks; indicators; interconnections; reliability; remaining life assessment; thermal stresses; α-λ metric; average bias; cracks; cumulative relative accuracy; damage equivalency methodology; damage initiation; damage proxies; delamination; electronic systems; failure macroindicators; field deployed electronics; heat sink; leading indicator based assessment; mean absolute percentage error; mean square error; microstructural evolution; perimeter type ball-grid arrays; prognostic metrics; reliability effect; remaining useful life assessment; residual life assessment; sample standard deviation; second-level lead free interconnects; sequential stresses; system state interrogation; thermal aging; thermal cycling; thermal stresses; thermomechanical cyclic life reduction; Abstracts; Aging; Assembly; Delamination; Equations; Jacobian matrices; Lead; Health Management; Lead-free alloys; Leading Indicators; Prognostics; Reliability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on
  • Conference_Location
    San Diego, CA
  • ISSN
    1087-9870
  • Print_ISBN
    978-1-4244-9533-7
  • Electronic_ISBN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2012.6231489
  • Filename
    6231489