DocumentCode :
2507162
Title :
Suppression of phosphorus diffusion using cluster Carbon co-implantation
Author :
Nagayama, Tsutomu ; Onoda, Hiroshi ; Tanjyo, Masayasu ; Hamamoto, Nariaki ; Umisedo, Sei ; Koga, Yuji ; Maehara, Noriaki ; Kawamura, Yasunori ; Nakashima, Yoshiki ; Hashino, Yoshikazu ; Hashimoto, Masahiro ; Yoshimi, Hideki ; Sezaki, Shinichi ; Nagai, Nob
Author_Institution :
Nissin Ion Equip. Co. Ltd., Kyoto, Japan
fYear :
2010
fDate :
10-11 May 2010
Firstpage :
1
Lastpage :
4
Abstract :
Phosphorus transient enhanced diffusion (TED) is caused by interstitial diffusion mechanism. It is important for the efficient suppression of phosphorus diffusion that some carbons could be located on lattice point in the initial stage of re-growth during annealing and trap interstitial Silicon. Carbon co-implantation after Germanium, pre-amorphization implantation (PAI) is applied for the applications of n+/p junction formation and the effects of Carbon co-implantation are reported. In our experiments it is shown that suppression of Phosphorus diffusion could be achieved with conventional rapid thermal annealing (RTA) by using cluster Carbon (C16Hx+, C7Hx+) co-implantation for the self-amorphization. Our experimental data suggests that cluster carbon co-implantation enable to suppress phosphorus diffusion without germanium pre-amorphous implantation. In this paper the characteristics of cluster Carbon co-implantation after RTA are introduced from experimental results which were obtained by secondary ion mass spectroscopy (SIMS) measurement, transmission electron microscopy (TEM) and sheet-resistance measurement.
Keywords :
amorphisation; carbon; diffusion; electrical resistivity; elemental semiconductors; ion implantation; p-n heterojunctions; phosphorus; rapid thermal annealing; secondary ion mass spectra; semiconductor doping; sheet materials; silicon; transmission electron microscopy; C16Hx+; C7Hx+; RTA; SIMS measurement; Si:P,C; TEM; cluster carbon coimplantation; germanium preamorphization implantation; interstitial diffusion; interstitial silicon; n+-p junction formation; phosphorus transient enhanced diffusion; rapid thermal annealing; secondary ion mass spectroscopy; self-amorphization; sheet-resistance measurement; transmission electron microscopy; Amorphous materials; Commercialization; Control systems; Electronic mail; Germanium; Lattices; Mass spectroscopy; Rapid thermal annealing; Silicon; Transmission electron microscopy;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Junction Technology (IWJT), 2010 International Workshop on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-5866-0
Type :
conf
DOI :
10.1109/IWJT.2010.5474979
Filename :
5474979
Link To Document :
بازگشت