DocumentCode :
2507163
Title :
Microscale heat transfer in macro geometries
Author :
Kong, Kian Shing ; Ooi, Kim Tiow
Author_Institution :
Sch. of Mech. & Aerosp. Eng., Nanyang Technol. Univ., Singapore, Singapore
fYear :
2012
fDate :
May 30 2012-June 1 2012
Firstpage :
669
Lastpage :
676
Abstract :
The escalating heat dissipation problem in electronic devices has become the key driver to numerous investigations on new cooling techniques, including the heavily-researched microchannel heat sink. However, literature shows that microscale heat transfer is generally not being applied to macro geometries, which is believed largely due to the fabrication and operational challenges. In present study, experiments were conducted to attain high heat removal capabilities comparable to that of microchannels in a circular channel of conventional size, which was manufactured through conventional techniques. The channel is 20 mm in diameter and 30 mm in length. Inserts of different sizes and profiles were inserted into the flow channel, one at a time, to make the annular flow path small enough to behave like a microchannel. The gap size of the flow channels experimented ranges from 200 to 1000 μm. Experimental results obtained showed that the design was able to achieve a maximum heat transfer coefficient of 79,000 W/m2·K with single-phase water flowing through the annular channel of gap size of 200 μm at Reynolds number of 5600.
Keywords :
cooling; heat sinks; heat transfer; microchannel flow; turbulence; Reynolds number; annular flow path; circular channel; cooling techniques; electronic devices; flow channel; heat dissipation problem; heat removal capability; macrogeometry; maximum heat transfer coefficient; microchannel heat sink; microscale heat transfer; single-phase water; size 20 mm; size 200 mum to 1000 mum; size 30 mm; Copper; Correlation; Current measurement; Heat transfer; Heating; Microchannel; Temperature measurement; enhanced; heat transfer; microchannel; single-phase;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on
Conference_Location :
San Diego, CA
ISSN :
1087-9870
Print_ISBN :
978-1-4244-9533-7
Electronic_ISBN :
1087-9870
Type :
conf
DOI :
10.1109/ITHERM.2012.6231492
Filename :
6231492
Link To Document :
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