• DocumentCode
    2507279
  • Title

    Investigation of capillary properties of copper metal foams by the rate of rise method in the presence of evaporation

  • Author

    Shirazy, Mahmood R S ; Fréchette, Luc G.

  • Author_Institution
    Dept. of Mech. Eng., Univ. de Sherbrooke, Sherbrooke, QC, Canada
  • fYear
    2012
  • fDate
    May 30 2012-June 1 2012
  • Firstpage
    710
  • Lastpage
    716
  • Abstract
    An experimental study has been done to define the capillary characteristics of a novel a type of copper metal foam which is to be used as a wick in flat heat pipes for electronic cooling. Capillary properties such as permeability (K) and effective pore radius (reff) are critical in defining the capillary limit of heat pipes, because their ratio (K/reff) i s a measure of pumping capacity of the wicking material. Foam strips with porosities of 68%, 75% and 82% are tested by the rate of rise method to measure K and reff. Impact of evaporation on the capillary rise has been studied by using acetone as test liquid in an open and a partially saturated ambient to reduce the evaporation rate. It was found out that the rate of evaporation while the liquid is rising is less than the evaporation rate of a saturated sample with stationary liquid. This will allow ignoring the evaporation effect in the mathematical model used to extract K and reff. By this simplification, rate of increasing of acetone and water weight with time is measured with a high precision balance and then, by using an appropriate mathematical model, K and reff are extracted. Results show that 75% porosity foam has the highest K/reff ratio which makes it a suitable candidate for a heat pipe wicking material.
  • Keywords
    cooling; copper; heat pipes; metal foams; acetone; capillary properties; copper metal foams; effective pore radius; electronic cooling; evaporation rate; flat heat pipes; heat pipe wicking material; mathematical model; permeability; porosity foam; pumping capacity; rate of rise method; stationary liquid; test liquid; water weight; Copper; Equations; Heating; Liquids; Mathematical model; Metal foam; capillary rise; evaporation; heat pipe; wick;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on
  • Conference_Location
    San Diego, CA
  • ISSN
    1087-9870
  • Print_ISBN
    978-1-4244-9533-7
  • Electronic_ISBN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2012.6231497
  • Filename
    6231497