DocumentCode
2507323
Title
Heat transfer and pressure drop characterization of a tubular evaporator using manifold on the microgrooved surfaces
Author
Jha, V. ; Dessiatoun, S. ; Ohadi, M.
Author_Institution
Dept. of Mech. Eng., Univ. of Maryland, College Park, MD, USA
fYear
2012
fDate
May 30 2012-June 1 2012
Firstpage
732
Lastpage
739
Abstract
Miniaturization of heat and mass exchanger is needed for increasing COP and energy efficiency. For small scale systems where ample of waste heat is available, huge initial cost for absorption chillers becomes a deterrent. The paper talks about development of a tubular evaporator based on manifold microchannel systems and the results associated with microgroove surface made of aluminum. Manifold guided flow has been utilized on micro-grooved structure of high aspect ratio channels. Aluminum surface channel width is 60 microns and channel height is close to 600 microns. Two different components - one based on force fed and other plain tube insert has been tested on water side for getting enhanced water side heat transfer coefficients. The results would be discussed for wide variation for refrigerant side and water side mass flow rates. Very high overall heat transfer coefficient more than 20,000 W/m2-k has been achieved using plain tube insert on water side of the evaporator with a modest pressure drop close to 100 mbars. Cooling capacity more than 4KW has been achieved too.
Keywords
cooling; heat exchangers; heat transfer; microchannel flow; refrigerants; waste heat; COP; absorption chillers; aluminum surface channel; coefficient of performance; cooling capacity; energy efficiency; enhanced water side heat transfer coefficients; heat exchanger miniaturization; heat transfer characterization; high aspect ratio channels; manifold guided flow; manifold microchannel systems; mass exchanger; microgrooved surfaces; plain tube; pressure drop characterization; refrigerant; size 60 micron; tubular evaporator; waste heat; water side mass flow rates; Heat transfer; Manifolds; Refrigerants; Temperature measurement; Waste heat; Water heating; Absorption refrigeration; Tubular evaporator; micro channels; micro cooling; waste heat recovery;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on
Conference_Location
San Diego, CA
ISSN
1087-9870
Print_ISBN
978-1-4244-9533-7
Electronic_ISBN
1087-9870
Type
conf
DOI
10.1109/ITHERM.2012.6231500
Filename
6231500
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