• DocumentCode
    2507471
  • Title

    Thermal management systems for data centers with liquid cooling technique of CPU

  • Author

    Ouchi, Mayumi ; Abe, Yoshiyuki ; Fukagaya, Masato ; Ohta, Haruhiko ; Shinmoto, Yasuhisa ; Sato, Masahide ; Iimura, Ken-ichi

  • Author_Institution
    Energy Enabling Tech. Group, AIST, Tsukuba, Japan
  • fYear
    2012
  • fDate
    May 30 2012-June 1 2012
  • Firstpage
    790
  • Lastpage
    798
  • Abstract
    Energy consumption in data centers has seen a drastic increase in recent years and approximately 40% of it is spent on cooling facilities. In data centers, server racks are cooled down indirectly by chilled air with an air conditioner. This technique is inefficient because IT equipment is not cool enough whereas the server room is overcooled. Under these circumstances, the authors have proposed liquid cooling systems in which CPUs are cooled down directly and exhaust heat is not radiated into the server room. Three cooling technique for CPUs are developed simultaneously. Two of them involve a single-phase heat exchanger and a two-phase heat exchanger as a cooling jacket. The other is flat heat pipes in order that the heat generated by CPU is cooled after being transported to the outside of the chassis. Condensation section of the heat pipe is cooled down by liquid with liquid manifold, so that there is no air cooling part in our new liquid cooling systems. Performance evaluation tests of the cooling devices have been conducted, which are single-phase heat exchanger, two-phase heat exchanger and two-types of flat heat pipes. Meanwhile, nanofluid technology for heat transfer enhancement and development of plug-in connectors for standardization of the systems are pursued. In addition, Verification tests have been carried out with using commercial servers. As a result, a 44% to 53% reduction in energy consumption of cooling facilities with single-phase cooling system was realized compared with conventional air cooling system.
  • Keywords
    air conditioning; computer centres; cooling; electric connectors; heat exchangers; heat pipes; heat transfer; nanofluidics; thermal management (packaging); CPU; IT equipment; air conditioner; air cooling system; chilled air; commercial servers; cooling devices; cooling facility; cooling jacket; data centers; energy consumption; flat heat pipes; heat pipe condensation section; heat transfer enhancement; liquid cooling systems; liquid cooling technique; nanofluid technology; performance evaluation tests; plug-in connectors; server rack cooling; server room; single-phase cooling system; single-phase heat exchanger; thermal management systems; two-phase heat exchanger; verification tests; Coolants; Liquid cooling; Resistance heating; Servers; Thermal resistance; PUE; energy conservation; flat heat pipes; nanofluids; plug-in system; single-phase heat exchanger; two-phase heat exchanger;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on
  • Conference_Location
    San Diego, CA
  • ISSN
    1087-9870
  • Print_ISBN
    978-1-4244-9533-7
  • Electronic_ISBN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2012.6231507
  • Filename
    6231507