Title :
Variable fidelity methodology for thermal battery modeling
Author :
Lewis, Hamish ; Zandi, Ben ; Lewis, Gareth ; Ketkar, Satish
Author_Institution :
TES Int. LLC, Troy, MI, USA
fDate :
May 30 2012-June 1 2012
Abstract :
Cell temperature is critical to the life and performance of a battery pack, therefore accurately modeling the complete thermal system is important. Traditional approaches use complex 3D heat transfer and CFD or use a 1D network solver for quick prediction of flow and thermal fields. The 1D and 3D models are linked to get an overall system model. However, this coupling procedure can be tedious and time-consuming. This paper introduces a complete thermal modeling methodology that offers approaches for modeling thermal management system combining the benefits of 1D and 3D models in a single system greatly reducing the model development and analysis time. A new software package, ADFlo, developed with the support of the US Army is used to demonstrate these benefits. This approach is applied to the thermal management system for a battery pack where flow balancing of the coolant has a significant impact on the performance of the system. Properly balanced flow will create an even temperature distribution increasing the performance and life of the system. This will be seen on a 3D solid model of the battery. The analyst can use this to study the effects of modification to the cold plate to ensure an even temperature.
Keywords :
battery management systems; battery powered vehicles; computational fluid dynamics; coolants; heat transfer; power engineering computing; solid modelling; temperature distribution; thermal management (packaging); 1D models; 1D network solver; 3D models; 3D solid model; ADFlo; CFD; US Army; battery pack; cell temperature; complex 3D heat transfer; coolant; flow prediction; software package; temperature distribution; thermal battery modeling; thermal fields; variable fidelity methodology; Batteries; Computational fluid dynamics; Computational modeling; Cooling; Heating; Mathematical model; Solid modeling; 3D; CAE; analysis; automotive; cooling; flow network; pressure; system;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-9533-7
Electronic_ISBN :
1087-9870
DOI :
10.1109/ITHERM.2012.6231532