High-G shock reliability of ceramic area-array packages

Electronics in aerospace applications may be subjected to very high g-levels during normal operation. A column array interconnect has been studied for reliability during extended duration aerospace missions in presence of high-g levels. Ceramic area-array components have been populated with column interconnects. The wire column interconnects are fabricated using a two piece fixture that holds a ceramic substrate. Solder columns are made with Sn5Pb95. Columns are attached using Sn10Pb90 in conjunction with an 8-mil thick stencil. Wire columns are 87 mils in height and have a 9 mil radius. Board assemblies have been subjected to high g-levels in multiple orientations. The board assemblies are daisy chained. Damage initiation and progression in interconnects has been measured using in-situ monitoring with high speed data-acquisition systems. Transient deformation of the board assemblies has been measured using high speed cameras with digital image correlation. Multiple board assemblies have been subjected to shock tests till failure. Peak shock pulse magnitudes range from 1,500g, typical of JEDEC standards, to very high g-levels of 50,000g. The column interconnects are daisy chained and failures are observed using electrical continuity. A finite element model using explicit global to local models has been used to study interconnect reliability under shock loads. The reliability performance of the ceramic column grid array (400CCGA) has been reported. Failure modes for the CCGA are determined. Models have been correlated with experimental data.