• DocumentCode
    2508125
  • Title

    Thermal conductivity, anisotropy, and interface resistances of diamond on poly-AlN

  • Author

    Bozorg-Grayeli, Elah ; Li, Zijian ; Gambin, Vincent ; Asheghi, Mehdi ; Goodson, Kenneth E.

  • Author_Institution
    Dept. of Mech. Eng., Stanford Univ., Stanford, CA, USA
  • fYear
    2012
  • fDate
    May 30 2012-June 1 2012
  • Firstpage
    1059
  • Lastpage
    1064
  • Abstract
    Due to their high thermal conductivity, diamond substrates are seen as a way to minimize the thermal resistance present in High Electron Mobility Transistor (HEMT) structures based on GaN. Single-crystal AlN transition layers facilitate the growth of high quality GaN on diamond, but such layers may increase the total thermal resistance of the composite substrate. This manuscript measures the thermal conductivity and interface resistance of a 1.4 μm diamond film on a polycrystalline AlN substrate using picosecond time-domain thermoreflectance (TDTR) and nanosecond thermoreflectance. Varying beam widths are used to extract the thermal conductivity anisotropy of the diamond film.
  • Keywords
    III-V semiconductors; aluminium compounds; diamond; gallium compounds; high electron mobility transistors; thermal conductivity; thermal resistance; thermoreflectance; wide band gap semiconductors; AlN; C; GaN; HEMT structures; TDTR; beam widths; composite substrate; diamond film; diamond substrates; high electron mobility transistor; interface resistances; nanosecond thermoreflectance; picosecond time-domain thermoreflectance; polycrystalline substrate; single-crystal transition layers; size 1.4 mum; thermal conductivity anisotropy; total thermal resistance; Conductivity; Diamond-like carbon; Gallium nitride; Logic gates; Resistance; Substrates; Thermal conductivity; Aluminum nitride; High Electron Mobility Transistors (HEMT); Thermal Boundary Resistance (TBR); Time-Domain Thermoreflectance (TDTR); diamond; thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on
  • Conference_Location
    San Diego, CA
  • ISSN
    1087-9870
  • Print_ISBN
    978-1-4244-9533-7
  • Electronic_ISBN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2012.6231541
  • Filename
    6231541