DocumentCode :
2508378
Title :
Thermal characterization of solar module due to impact of solar heat flux as an effect of geographical topology
Author :
Trifale, Ninad ; Kaisare, Abhijit ; Tonapi, Sandeep
Author_Institution :
Vishwakarma Inst. of Technol., Pune, India
fYear :
2012
fDate :
May 30 2012-June 1 2012
Firstpage :
1139
Lastpage :
1143
Abstract :
Currently just a thousandth of a part of the total solar flux reaching our planet is being used as an effective energy source. In the foreseeable future this use is expected to rise where reliability will be a major factor worth consideration during the design process. A steady state thermal analysis is carried out of a typical solar module assembly to study impact of solar heat flux as a function of time of day and geographic location. A three dimensional finite element model of a module that consists of silicon cells and bus bars sandwiched between glass cover and backsheet using an EVA and adhesive is solved numerically to predict the temperature variation of the solar module assembly. In the analysis the boundary conditions imposed with respect to variation of heat flux as a function of the day of year and geographical topology is applied to the module and temperature variations are evaluated. A parametric study is carried out to study effect of critical parameters such as intensity of solar flux and geographical location on the overall temperature distribution of the solar module assembly. The behavior is studied at selected major cities across the globe and the results are compared on the basis of particular season of the year (fall, spring etc.) and intensity of maximum temperatures observed. A general trend of variation of maximum temperature levels according to the geographical topology is established. Recommendations are provided to minimize the maximum junction temperature which eventually results in a productive design and installation of a solar module assembly.
Keywords :
busbars; finite element analysis; reliability; silicon; solar cells; temperature distribution; EVA; Si; adhesive; backsheet; bus bars; design process; energy source; geographic location; geographical topology; geographical topology effect; glass cover; maximum junction temperature; maximum temperature variation; reliability; silicon cells; solar flux; solar flux reaching; solar heat flux; solar module assembly; steady state thermal analysis; temperature distribution; thermal characterization; three dimensional finite element model; Assembly; Cities and towns; Continents; Finite element methods; Heating; Solar radiation; Temperature distribution; Geographical topology; Insolation; Solar Module; Temperature Distribution;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on
Conference_Location :
San Diego, CA
ISSN :
1087-9870
Print_ISBN :
978-1-4244-9533-7
Electronic_ISBN :
1087-9870
Type :
conf
DOI :
10.1109/ITHERM.2012.6231551
Filename :
6231551
Link To Document :
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