• DocumentCode
    2508468
  • Title

    Understanding of the temperature dependence of channel hot-carrier degradation in the range 77 K to 300 K

  • Author

    Heremans, P. ; Van den Bosch, G. ; Bellens, R. ; Groeseneken, G. ; Maes, H.E.

  • Author_Institution
    IMEC, Leuven, Belgium
  • fYear
    1989
  • fDate
    3-6 Dec. 1989
  • Firstpage
    67
  • Lastpage
    70
  • Abstract
    The mechanisms of the enhanced degradation of the n-MOSFET current after low-temperature hot-carrier stress are investigated. It is found that the enhanced electron trapping at low temperatures can only explain a small fraction of this enhanced degradation. The generation of D/sub it/ is shown to decrease at low temperatures. The enhanced degradation at low T is therefore not due to increased interfacial damage. It is shown to be caused by the greater influence of the local hot-carrier-induced damage on the transistor characteristics at low T, due to the dramatic reduction of the thermionic emission process that controls the channel current. In p-MOSFETs, however, the hot-carrier degradation is due to channel shortening effects, which are not governed by the thermionic emission process. The degradation is therefore not highly dependent on temperature in this case.<>
  • Keywords
    hot carriers; insulated gate field effect transistors; thermionic electron emission; 77 to 300 K; channel hot-carrier degradation; channel shortening; electron trapping; local hot-carrier-induced damage; n-MOSFET current; p-MOSFETs; temperature dependence; thermionic emission process; transistor characteristics; Charge measurement; Charge pumps; Cryogenics; Current measurement; Degradation; Hot carriers; MOSFET circuits; Stress measurement; Temperature dependence; Thermionic emission;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1989. IEDM '89. Technical Digest., International
  • Conference_Location
    Washington, DC, USA
  • ISSN
    0163-1918
  • Print_ISBN
    0-7803-0817-4
  • Type

    conf

  • DOI
    10.1109/IEDM.1989.74229
  • Filename
    74229