• DocumentCode
    2508762
  • Title

    Comparison of Lalman-filter and extended Kalman-filter for prognostics health management of electronics

  • Author

    Lall, Pradeep ; Wei, Junchao ; Goebel, Kai

  • Author_Institution
    Dept. of Mech. Eng., Auburn Univ., Auburn, AL, USA
  • fYear
    2012
  • fDate
    May 30 2012-June 1 2012
  • Firstpage
    1281
  • Lastpage
    1291
  • Abstract
    Electronic interconnects may encounter damage under exposure to vibration and mechanical shock. The damage may manifest itself as an open circuit after a finite period of operation. The traditional methods for damage detection such as microscopy and x-ray are destructive in nature and provide limited information offline. In this paper, resistance spectroscopy and phase-sensitive detection based state space vectors have been used to monitor the health of interconnects and assess remaining useful life. Two techniques including Kalman Filter and Extended Kalman Filter have been used to estimate the future state of the system. The measured state variable has been related to the underlying interconnect damage in the form of inelastic strain energy density. Performance of both the prognostication health management algorithms during vibration and mechanical shock has been quantified using performance evaluation metrics. The methodology has been demonstrated on lead-free area-array and advanced interconnect electronic assemblies. Model predictions have been correlated with experimental data. The presented approach is applicable to functional systems where corner interconnects in area-array packages may be often redundant. Prognostic metrics including α-λ metric, sample standard deviation, mean square error, mean absolute percentage error, average bias, relative accuracy, and cumulative relative accuracy have been used to assess the performance of the damage proxies. The presented approach enables the estimation of residual life based on level of risk averseness.
  • Keywords
    Kalman filters; assembling; electronics packaging; interconnections; nonlinear filters; remaining life assessment; state-space methods; vibrations; α-λ metric; X-ray; advanced interconnect electronic assembly; area-array packages; average bias; cumulative relative accuracy; damage detection; damage proxies; electronic interconnects; extended Kalman-filter; functional systems; inelastic strain energy density; interconnect damage; lead-free area-array; mean absolute percentage error; mean square error; mechanical shock; microscopy; performance evaluation metrics; phase-sensitive detection; prognostication health management algorithms; remaining useful life assessment; resistance spectroscopy; sample standard deviation; state space vectors; state variable; vibration; Covariance matrix; Kalman filters; Mathematical model; Noise; Noise measurement; Resistance; Vectors; Prognostic health management; leading indicators; reliability; shock; vibration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on
  • Conference_Location
    San Diego, CA
  • ISSN
    1087-9870
  • Print_ISBN
    978-1-4244-9533-7
  • Electronic_ISBN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2012.6231569
  • Filename
    6231569