Title :
Optimized and microfabricated ionic wind pump array as a next generation solution for electronics cooling systems
Author :
Ong, Andojo Ongkodjojo ; Abramson, Alexis R. ; Tien, Norman C.
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Case Western Reserve Univ., Cleveland, OH, USA
fDate :
May 30 2012-June 1 2012
Abstract :
This work presents a microfabricated ionic wind pump array that has the potential to meet industry requirements as a next generation solution for thermal management of electronic systems. The optimized single device provides an improved COP of 26.5. The main purpose of the work presented here is to demonstrate that the optimized microfabricated ionic wind pump employed in an array provides superior cooling performance as compared to conventional CPU fans.
Keywords :
cooling; microfabrication; pumps; thermal management (packaging); COP; CPU fans; coefficient of performance; electronics cooling systems; microfabricated ionic wind pump array; next generation solution; optimized single device; thermal management; Arrays; Corona; Heat pumps; Heat sinks; Heat transfer; Resistance heating; CPU fan; corona discharge; electrohydrodynamics; emerging technology; forced convection air cooling; heat transfer; optimized design; semiconductor; thermal management;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-9533-7
Electronic_ISBN :
1087-9870
DOI :
10.1109/ITHERM.2012.6231571
