• DocumentCode
    2508860
  • Title

    Frictionless air flow blade fan for thermal management of electronics

  • Author

    Schacht, R. ; Hausdorf, A. ; Wunderle, B. ; Michel, Bruno

  • Author_Institution
    Lausitz Univ. of Appl. Sci., Senftenberg, Germany
  • fYear
    2012
  • fDate
    May 30 2012-June 1 2012
  • Firstpage
    1320
  • Lastpage
    1326
  • Abstract
    This paper introduces a miniaturized frictionless fan concept, which is similar to a piezo-electric driven fan principle. This type of fan has been employed for the enhancement of heat transfer by increasing the fluid circulation in regions which are otherwise stagnant. The introduced fan is based on a flexible blade whose vibration is driven by means of a magnetic field. As opposed to the piezo-electric fan, the blade material can be based on a polymer or steel blade. A static mechanical FE-analysis has shown good potential for a reliable, frictionless (i.e. highly reliable) fan compared to the piezo-electric one or to small axial or radial fans. A flow rate of ~11 l/min could be reached. This is 1/3 below to the compared piezo-electric fan. But the advantage of the introduced fan compared to the piezo-electric fan is its low driving voltage of 2.5 V instead of 120 V. The paper will describe the principle and first experimental results.
  • Keywords
    blades; fans; finite element analysis; heat transfer; thermal management (packaging); vibrations; axial fans; blade material; flexible blade; fluid circulation; frictionless air flow blade fan; heat transfer enhancement; magnetic field; piezoelectric driven fan principle; polymer; radial fans; static mechanical FE-analysis; steel blade; thermal management; vibration; voltage 120 V; voltage 2.5 V; Blades; Coils; Fans; Heat transfer; Reliability; Stress; Temperature measurement; frictionless cooling; noiseless cooling; reliable air flow fan; thermal management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on
  • Conference_Location
    San Diego, CA
  • ISSN
    1087-9870
  • Print_ISBN
    978-1-4244-9533-7
  • Electronic_ISBN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2012.6231573
  • Filename
    6231573