Socket thermal modeling and test correlation with learning on board temperature prediction

With increasingly high currents flowing though CPU sockets in thermally-challenged systems, socket temperatures have recently been projected to approach, and even exceed, their thermal reliability limits. The prediction of socket and board temperatures through modeling and simulation is well-established and refined. The modeling methodology based on CFD simulation accounts for Joule heating power losses from motherboard traces using a localized board thermal conductivity. A testing methodology has also been developed that allows for the direct measurement of socket contact temperatures and various board temperatures using thermocouples. In this socket thermal modeling and test correlation study, the impact of the motherboard, processors, and power delivery component temperatures, as well as different air flow velocities, CPU powers, and board power losses are seen. Additionally, the sensitivity of board temperature prediction to VR FET temperature and board trace power losses provides invaluable learning that can be applied to future platform planning, design, and development.