DocumentCode :
2508929
Title :
Enhanced heat transfer with jet impingement on structured-porous surfaces
Author :
Zhao, Zenghui ; Peles, Yoav ; Jensen, Michael K.
Author_Institution :
Center for Autom. Technol. & Syst., Rensselaer Polytech. Inst., Troy, NY, USA
fYear :
2012
fDate :
May 30 2012-June 1 2012
Firstpage :
1348
Lastpage :
1353
Abstract :
A new heat transfer method, which combines the merits of liquid jet impingement heat transfer with metallic porous surfaces, is proposed. The porous surface was made by sintering a single layer or multiple layers of copper wire mesh screen to a plain copper base heat transfer surface. Experiments were conducted with a 2.0-mm diameter circular water jet impinging onto a 6.35-mm diameter circular porous surface. The effects of jet subcooling, flow rates, and porous layer thickness on jet impingement heat transfer performance were explored under atmospheric pressure. The results show that increased subcooling improves heat transfer performance, and that flow rate has an insignificant effect on heat transfer performance when boiling is fully established. The effect of porous layer thickness depends on the specific working condition. With a four layer porous surface, a heat flux of 720 W/cm2 was reached at a wall superheat of 12.4 K.
Keywords :
atmospheric pressure; cooling; copper; flow through porous media; heat transfer; jets; sintering; atmospheric pressure; boiling; circular porous surface; circular water jet; copper wire mesh screen; enhanced heat transfer method; flow rates; heat flux; jet subcooling effect; liquid jet impingement heat transfer; metallic porous surfaces; plain copper base heat transfer surface; porous layer thickness effect; sintering; size 2.0 mm; size 6.35 mm; structured-porous surfaces; temperature 12.4 K; Copper; Heat transfer; Heating; Liquids; Surface treatment; Temperature measurement; Wires; boiling; heat flux; heat transfer coefficient porous; jet impingement; thermal management;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on
Conference_Location :
San Diego, CA
ISSN :
1087-9870
Print_ISBN :
978-1-4244-9533-7
Electronic_ISBN :
1087-9870
Type :
conf
DOI :
10.1109/ITHERM.2012.6231577
Filename :
6231577
Link To Document :
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