Title :
Investigation and application of an advanced dual piezoelectric cooling jet to a typical electronics cooling configuration
Author :
De Bock, H. Peter ; Chamarthy, Pramod ; Jackson, Jennifer L. ; Whalen, Bryan
Author_Institution :
Electron. Cooling Lab., GE Global Res., Niskayuna, NY, USA
fDate :
May 30 2012-June 1 2012
Abstract :
In recent years, electronics have significantly reduced in size at maintained or increased functionality. This trend has led to an increased demand for more capable thermal management solutions at smaller scales. However, miniaturization of conventional fan and heat sink cooling systems introduces significant size, weight and efficiency challenges. In this study the flow performance of a novel thin form-factor cooling solution, the advanced dual piezoelectric cooling jet (DCJ), is evaluated. A DCJ is a micro-fluidic device that disturbs the boundary layer over a hot component and hence increases heat transfer. The design of an equivalent fan-curve experiment is described in detail. A first ever fan curve for a bimorph DCJ device is presented. This is coupled to a thermal performance analysis using an experiment simulating thin profile consumer electronics.
Keywords :
consumer electronics; cooling; fans; heat sinks; jets; microfluidics; piezoelectricity; thermal analysis; thermal management (packaging); advanced dual piezoelectric cooling jet; bimorph DCJ device; boundary layer; electronics cooling configuration; equivalent fan-curve experiment design; experiment simulating thin profile consumer electronics; fan miniaturization; flow performance; heat sink cooling systems; heat transfer; microfluidic device; thermal management solutions; thermal performance analysis; thin form-factor cooling solution; Consumer electronics; Fluid flow measurement; Fluidics; Heat sinks; Heat transfer; Performance evaluation; Convection; DCJ; Experimental method; Fan-curve; Micro fluidics; Miniature; Thermal; electronics;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-9533-7
Electronic_ISBN :
1087-9870
DOI :
10.1109/ITHERM.2012.6231582