DocumentCode :
2509068
Title :
Transient analysis based thermal characterization of die-die interfaces in 3D-ICs
Author :
Oprins, H. ; Cherman, V. ; Rebibis, K. ; Vermeersch, K. ; Gerets, C. ; Vandevelde, B. ; Manna, A. La ; Beyer, G. ; Beyne, E.
Author_Institution :
Imec, Leuven, Belgium
fYear :
2012
fDate :
May 30 2012-June 1 2012
Firstpage :
1395
Lastpage :
1404
Abstract :
In this paper, we present a novel methodology using a thermal test chip to characterize the bulk thermal conductivity and the thermal contact resistance of underfill materials in die-die interfaces of 3D stacks for application-realistic test conditions. Since a silicon chip is used, the thermal properties can be extracted for the same material interfaces (finishing of the Si surface) and the same processing conditions (bonding and temperature profile during curing of the underfill material) as in the intended application. In the proposed methodology, transient thermal measurements obtained using a test chip with integrated heaters and sensors, are combined with thermal finite element simulations to extract the thermal properties. The proposed method is applied to extract the thermal properties and compare the thermal performance of 8 underfill materials. The materials are thermally characterized before and after curing. It is shown that the comparison of the temperature profiles before and after curing can indicate void formation or delamination during the curing stage.
Keywords :
contact resistance; integrated circuit packaging; integrated circuit testing; thermal resistance; three-dimensional integrated circuits; transient analysis; voids (solid); 3D-IC; Si; application-realistic test conditions; curing; delamination; die-die interfaces; integrated heaters; sensors; temperature profile; temperature profiles; thermal characterization; thermal contact resistance; thermal properties; thermal test chip; transient analysis; transient thermal measurements; underfill materials; void formation; Materials; Semiconductor device measurement; Temperature measurement; Temperature sensors; Thermal conductivity; Thermal resistance; Voltage measurement; 3D-IC; conductivity measurements; transient thermal testing; underfill;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on
Conference_Location :
San Diego, CA
ISSN :
1087-9870
Print_ISBN :
978-1-4244-9533-7
Electronic_ISBN :
1087-9870
Type :
conf
DOI :
10.1109/ITHERM.2012.6231583
Filename :
6231583
Link To Document :
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