DocumentCode
2509195
Title
The manufacturing logistics of cofire ceramic electronic packages
Author
Carr, Timothy W.
Author_Institution
Alcoa Electron. Packaging Inc., San Diego, CA, USA
fYear
1996
fDate
14-16 Oct 1996
Firstpage
322
Lastpage
328
Abstract
The manufacturing cycletime of cofire ceramic Pin Grid Array (PGA) electronic packages has been modeled using the principles of chemical kinetics. In this paper, the rates and mechanisms of chemical reactions are discussed in relation to the manufacturing cycletime. Alcoa Electronic Packaging has used this methodology to achieve world class status in the manufacturing of Pin Grid Array electronic packages
Keywords
integrated circuit manufacture; integrated circuit packaging; production control; Alcoa Electronic Packaging; chemical kinetics model; cofire ceramic electronic packages; manufacturing cycletime; manufacturing logistics; pin grid array packages; Ceramics; Chemicals; Consumer electronics; Electronics packaging; Kinetic theory; Logistics; Manufacturing processes; Nickel; Pulp manufacturing; Virtual manufacturing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Manufacturing Technology Symposium, 1996., Nineteenth IEEE/CPMT
Conference_Location
Austin, TX
ISSN
1089-8190
Print_ISBN
0-7803-3642-9
Type
conf
DOI
10.1109/IEMT.1996.559750
Filename
559750
Link To Document