DocumentCode
2509230
Title
An Ontology Model for Manufacturing Grid Service by Extending OWL-S
Author
Wang, Mingwei ; Li, Shan ; Zhou, Jingtao
Author_Institution
Key Lab. of Contemporary Design & Integrated Manuf. Technol. Minist. of Educ., Northwestern Polytech. Univ., Xi´´an, China
fYear
2011
fDate
18-19 June 2011
Firstpage
212
Lastpage
215
Abstract
Manufacturing grid is a new pattern developed to answer unprecedented challenges in manufacturing industry, one of the most important foundations of which is encapsulating or modeling manufacturing resources into grid service. But this kind of grid service is restricted by ambiguous and insufficient service description. This paper presents an ontology model, called M-service profile ontology, which provides the framework for explicitly encoding semantics of domain-specific engineering information. The model is generated by extending OWL-S with two classes. One is ManufacturingProfile class which provides formal engineering indexes needed during collaborative work. Anther is the QoSProfile class which provides a mechanism to represent quality of service. This ontology model enriches semantic descriptions of grid service which will be very conducive for later service discovery and management.
Keywords
Web services; agile manufacturing; grid computing; knowledge representation languages; ontologies (artificial intelligence); production engineering computing; quality of service; service-oriented architecture; Anther; M-service profile ontology; OWL-S; QoSprofile class; Web service; agile manufacturing; domain-specific engineering information; manufacturing grid service; manufacturing industry; manufacturingprofile class; ontology model; quality of service; service-oriented architecture; Manufacturing; Measurement; OWL; Ontologies; Quality of service; Semantics; Web services; OWL-S; manufacturing grid service; ontology; quality of service;
fLanguage
English
Publisher
ieee
Conference_Titel
Future Computer Sciences and Application (ICFCSA), 2011 International Conference on
Conference_Location
Hong Kong
Print_ISBN
978-1-4577-0317-1
Type
conf
DOI
10.1109/ICFCSA.2011.55
Filename
5968061
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