DocumentCode :
2509844
Title :
Packaging Of Liquid Crystal On Silicon Modulators Using Solder
Author :
Teh-Hua Ju ; Wei Lin ; Lee, Y.C. ; Johnson, K.M.
Author_Institution :
University of Colorado
fYear :
1993
fDate :
19-21 July 1993
Keywords :
Glass; Integrated circuit technology; Liquid crystal displays; Liquid crystal on silicon; Metallization; Packaging; Soldering; Switches; Vehicles; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Optical Microwave Interactions/Visible Semiconductor Lasers/Impact of Fiber Nonlinearities on Lightwave Systems/Hybrid Optoelectronic Integration and Packaging/Gigabit Networks., LEOS 1993 Summer Topi
Conference_Location :
Santa Barbara, CA, USA
Print_ISBN :
0-7803-1284-8
Type :
conf
DOI :
10.1109/LEOSST.1993.696864
Filename :
696864
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2509844
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