• DocumentCode
    2510025
  • Title

    Performance of reduced wall EPR insulated medium voltage power cables. I. Electrical characteristics

  • Author

    Cinquemani, Paul L. ; Wen, Yingli ; Kuchta, Frank L. ; Doench, Claus

  • Author_Institution
    Pirelli Cable Corp., Lexington, SC, USA
  • fYear
    1996
  • fDate
    15-20 Sep 1996
  • Firstpage
    417
  • Lastpage
    424
  • Abstract
    Paper insulated lead covered cables (PILC) have had a long and successful heritage. After almost 100 years, this design of cable is still in operation and continues to be manufactured. However, utilities are now looking for a reliable replacement for PILC cables. This is due to two primary reasons: (1) difficulty in installing and maintaining this type of cable, and (2) increasing pressure to replace these cables due to environmental concerns. To date, diameter limitations of conventional extruded dielectric cables has impeded their replacement in existing PILC conduits. This paper describes a study for the evaluation for reliably reducing the insulation thickness to achieve a lower diameter cable to effectively replace PILC cable in existing conduits. Part I of the investigation reviews the theory of insulation wall determination and the test program carried out to evaluate electrical performance of reduced wall EPR cables. Additionally, cable design concepts and constructions are discussed
  • Keywords
    ethylene-propylene rubber; insulation testing; power cable insulation; power cable testing; cable design concepts; cable design constructions; electrical characteristics; extruded dielectric cables; insulation thickness reduction; medium voltage power cables; reduced wall EPR insulated power cables; test program; Cable insulation; Conductors; Dielectrics and electrical insulation; IEC standards; Manufacturing; Mechanical cables; Medium voltage; Paramagnetic resonance; Power cables; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Transmission and Distribution Conference, 1996. Proceedings., 1996 IEEE
  • Conference_Location
    Los Angeles, CA
  • Print_ISBN
    0-7803-3522-8
  • Type

    conf

  • DOI
    10.1109/TDC.1996.547549
  • Filename
    547549