Title :
Fourth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium (Cat. No.88CH2530-4)
Abstract :
The following topics were dealt with: thermal measurement systems and techniques; thermal modeling; thermal characterization of IC packagings; thermal analysis; effects of radiation on enhanced electronic cooling; thermal design of ICs; wind tunnels; semiconductor device thermal factors; and diamond heat sinks. Abstracts of individual papers can be found under the relevant classification codes in this or other issues
Keywords :
cooling; digital simulation; electronic engineering computing; heat sinks; integrated circuit technology; packaging; radiation effects; semiconductor device testing; thermal variables measurement; wind tunnels; IC packagings; diamond heat sinks; effects of radiation; electronic cooling; electronic engineering computing; semiconductor device; thermal analysis; thermal design; thermal measurement systems; thermal modeling; wind tunnels;
Conference_Titel :
Semiconductor Thermal and Temperature Measurement Symposium, 1988. SEMI-THERM IV., Fourth Annual IEEE
Conference_Location :
San Diego, CA, USA
DOI :
10.1109/SEMTHE.1988.10588
