Hybrid Integration Of Electrical And Optical Interconnect For MCMs Appficatibns

Summary form only given. We discusses a recent effort in developing an integrated approach for electrical and optical interconnect for MCMs applications. This approach employs a high-density interconnect (HDI) process which uses thin-film polymeric overlay to hybrid integrate both photonic and electronic devices within a multichip module. The optical waveguide channel can be constructed within the same MCM structure using same planer processes. In addition, an laser lithography technique is applied to pattern optical and electrical interconnects adaptively to eliminate critical steps required for alignment between optical components and waveguide channels.