Title :
Fabrication Issues For Free-space Optics At The Board Packaging Level
Author_Institution :
University of Arizona
Keywords :
Electronics packaging; Electrooptic devices; Integrated circuit interconnections; Optical crosstalk; Optical device fabrication; Optical devices; Optical interconnections; Optical receivers; Propagation delay; Signal processing;
Conference_Titel :
Optical Microwave Interactions/Visible Semiconductor Lasers/Impact of Fiber Nonlinearities on Lightwave Systems/Hybrid Optoelectronic Integration and Packaging/Gigabit Networks., LEOS 1993 Summer Topi
Conference_Location :
Santa Barbara, CA, USA
Print_ISBN :
0-7803-1284-8
DOI :
10.1109/LEOSST.1993.696871
