Title :
Junction-to-case thermal resistance-still a myth?
Author_Institution :
Nat. Semicond. Corp., Santa Clara, CA, USA
Abstract :
After a brief review of MIL-STD-883C: Method 102 and SEMI Std. Doc. #1321 for junction-to-case thermal resistance (θJC) measurements, an experiment to measure θ JC of different K packages while altering the extrinsic variables is described. It is concluded that junction-to-case thermal resistance is not a physical constant: measurement conditions have a significant influence on this data. Thus, in order to make use of θJC data, it should be accompanied by measurement conditions, such as die size, power, and environment (type and intensity). These measurement conditions, all within the Standard´s guideline, are discussed and recommendations for proper presentation and use of the information are emphasized
Keywords :
measurement standards; military systems; thermal resistance measurement; MIL-STD-883C; die size; environment; junction-to-case thermal resistance; measurement conditions; measurement standards; military standards; power; Ceramics; Electrical resistance measurement; Electronic packaging thermal management; Measurement standards; Power measurement; Semiconductor device packaging; Temperature; Thermal management; Thermal resistance; Thermal variables measurement;
Conference_Titel :
Semiconductor Thermal and Temperature Measurement Symposium, 1988. SEMI-THERM IV., Fourth Annual IEEE
Conference_Location :
San Diego, CA
DOI :
10.1109/SEMTHE.1988.10590
