Title :
Advanced chip-in-board thin film hybrid technology with integrated polyimide film capacitors for ultra high-speed and millimeter-wave applications
Author :
Nohr, Wolf-Dieter ; Hanke, Gerhard ; Weber, Dieter-Jurgen
Author_Institution :
Technologiezentrum Darmstadt, Deutsche Telekom, Berlin, Germany
Abstract :
The processing of extreme high bit rates (⩾20 Gbit/s) or signal frequencies (⩾20 GHz) is of increasing importance for advanced telecommunications. Therefore a suitable circuit arrangement is necessary. Problems like frequency dispersion of microstrip lines, frequency dependence of parasitic impedances, and transforming characteristics of any finite length of layer must be solved. For this purpose a chip-in-board embedding technique with integrated film capacitors was developed. The article describes the manufacturing of such thin film hybrid circuits containing planar capacitors and feed-through capacitors. The chip interconnection technology is represented too
Keywords :
beam-lead devices; electric impedance; high-speed integrated circuits; hybrid integrated circuits; integrated circuit interconnections; integrated circuit packaging; microstrip lines; millimetre wave integrated circuits; thin film capacitors; 20 GHz; 20 Gbit/s; chip interconnection technology; chip-in-board thin film hybrid technology; circuit arrangement; feed-through capacitors; frequency dependence; frequency dispersion; high bit rates; integrated polyimide film capacitors; microstrip lines; millimeter-wave applications; parasitic impedances; planar capacitors; reverse beam-lead technology; signal frequencies; telecommunications; thin film hybrid circuits; transforming characteristics; ultra high-speed applications; Bit rate; Capacitors; Frequency dependence; Impedance; Integrated circuit technology; Manufacturing; Microstrip; Signal processing; Thin film circuits; Transistors;
Conference_Titel :
Radio and Wireless Conference, 1998. RAWCON 98. 1998 IEEE
Conference_Location :
Colorado Springs, CO
Print_ISBN :
0-7803-4988-1
DOI :
10.1109/RAWCON.1998.709149
