• DocumentCode
    2510767
  • Title

    BJT circuits simulation including self-heating effect using FDTD method

  • Author

    Amin, A.R. ; Salehi, A. ; Ghezelayagh, M.H.

  • Author_Institution
    Dept. of Electr. Eng., K.N.Toosi Univ. of Technol., Tehran, Iran
  • fYear
    2010
  • fDate
    12-16 April 2010
  • Firstpage
    924
  • Lastpage
    927
  • Abstract
    In this paper the operation of Bipolar Junction Transistor (BJT) with self-heating effect is simulated by 3-dimensional Finite-Difference Time-Domain (FDTD) method. A three-dimensional simulation program is developed in which the effect of the operating point on the BJT internal temperature rise is included. The simulation software works out the change in temperature by calculating the BJT power dissipation and repeats the simulation process by applying the new obtained temperature into the Gummel-Poon (GP) model. The two consecutive simulation results will determine the simulation iteration. The comparison between the experimental results and those of CAD-Thermal simulation and the FDTD simulation results shows that it is possible to add new features to the FDTD simulation.
  • Keywords
    bipolar transistors; electronic design automation; finite difference time-domain analysis; 3D finite difference time domain method; BJT circuits simulation; BJT internal temperature rise; BJT power dissipation; CAD thermal simulation; FDTD method; FDTD simulation; Gummel-Poon model; bipolar junction transistor; self-heating effect; simulation iteration; simulation software; three-dimensional simulation program; Bipolar transistor circuits; Circuit analysis; Circuit simulation; Electromagnetic analysis; Electromagnetic compatibility; Finite difference methods; Kirchhoff´s Law; Maxwell equations; Temperature; Time domain analysis; BJT; FDTD; GP model; thermal effect;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility (APEMC), 2010 Asia-Pacific Symposium on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-5621-5
  • Type

    conf

  • DOI
    10.1109/APEMC.2010.5475525
  • Filename
    5475525