DocumentCode
2510767
Title
BJT circuits simulation including self-heating effect using FDTD method
Author
Amin, A.R. ; Salehi, A. ; Ghezelayagh, M.H.
Author_Institution
Dept. of Electr. Eng., K.N.Toosi Univ. of Technol., Tehran, Iran
fYear
2010
fDate
12-16 April 2010
Firstpage
924
Lastpage
927
Abstract
In this paper the operation of Bipolar Junction Transistor (BJT) with self-heating effect is simulated by 3-dimensional Finite-Difference Time-Domain (FDTD) method. A three-dimensional simulation program is developed in which the effect of the operating point on the BJT internal temperature rise is included. The simulation software works out the change in temperature by calculating the BJT power dissipation and repeats the simulation process by applying the new obtained temperature into the Gummel-Poon (GP) model. The two consecutive simulation results will determine the simulation iteration. The comparison between the experimental results and those of CAD-Thermal simulation and the FDTD simulation results shows that it is possible to add new features to the FDTD simulation.
Keywords
bipolar transistors; electronic design automation; finite difference time-domain analysis; 3D finite difference time domain method; BJT circuits simulation; BJT internal temperature rise; BJT power dissipation; CAD thermal simulation; FDTD method; FDTD simulation; Gummel-Poon model; bipolar junction transistor; self-heating effect; simulation iteration; simulation software; three-dimensional simulation program; Bipolar transistor circuits; Circuit analysis; Circuit simulation; Electromagnetic analysis; Electromagnetic compatibility; Finite difference methods; Kirchhoff´s Law; Maxwell equations; Temperature; Time domain analysis; BJT; FDTD; GP model; thermal effect;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility (APEMC), 2010 Asia-Pacific Symposium on
Conference_Location
Beijing
Print_ISBN
978-1-4244-5621-5
Type
conf
DOI
10.1109/APEMC.2010.5475525
Filename
5475525
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