DocumentCode :
2510776
Title :
Photodefinable polyimides. II. The characterization and processing of photosensitive polyimide systems
Author :
Pottiger, Michael T. ; Goff, David L. ; Lautenberger, William J.
Author_Institution :
E.I. du Pont de Nemours & Co., Wilmington, DE, USA
fYear :
1988
fDate :
9-11 May 1988
Firstpage :
315
Lastpage :
321
Abstract :
Two negative-working photodefinable polyimides with different backbones have been prepared using a four-step synthesis process based on polyiminolactone chemistry. These polyimides have been formulated, coated onto silicon wafers, patterned directly using standard UV microphotolithography, and thermally cured to produce polyimide relief structures. Aspects of the synthesis and processing are discussed, and the properties of the two polyimides after curing are compared.<>
Keywords :
photolithography; polymer films; Si; UV photolithography; backbone chemistry; characterization; coated onto silicon wafers; four-step synthesis process; negative-working photodefinable polyimides; photosensitive polyimide systems; polyimide relief structures; polyimides after curing; polyiminolactone chemistry; processing; properties; standard UV microphotolithography; thermally cured; Chemistry; Inorganic materials; Insulation; Materials reliability; Microelectronics; Polyimides; Polymers; Resists; Silicon; Spine;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Components Conference, 1988., Proceedings of the 38th
Conference_Location :
Los Angeles, CA, USA
Type :
conf
DOI :
10.1109/ECC.1988.12610
Filename :
12610
Link To Document :
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