DocumentCode
2510776
Title
Photodefinable polyimides. II. The characterization and processing of photosensitive polyimide systems
Author
Pottiger, Michael T. ; Goff, David L. ; Lautenberger, William J.
Author_Institution
E.I. du Pont de Nemours & Co., Wilmington, DE, USA
fYear
1988
fDate
9-11 May 1988
Firstpage
315
Lastpage
321
Abstract
Two negative-working photodefinable polyimides with different backbones have been prepared using a four-step synthesis process based on polyiminolactone chemistry. These polyimides have been formulated, coated onto silicon wafers, patterned directly using standard UV microphotolithography, and thermally cured to produce polyimide relief structures. Aspects of the synthesis and processing are discussed, and the properties of the two polyimides after curing are compared.<>
Keywords
photolithography; polymer films; Si; UV photolithography; backbone chemistry; characterization; coated onto silicon wafers; four-step synthesis process; negative-working photodefinable polyimides; photosensitive polyimide systems; polyimide relief structures; polyimides after curing; polyiminolactone chemistry; processing; properties; standard UV microphotolithography; thermally cured; Chemistry; Inorganic materials; Insulation; Materials reliability; Microelectronics; Polyimides; Polymers; Resists; Silicon; Spine;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Components Conference, 1988., Proceedings of the 38th
Conference_Location
Los Angeles, CA, USA
Type
conf
DOI
10.1109/ECC.1988.12610
Filename
12610
Link To Document