• DocumentCode
    2510920
  • Title

    The Implementation of a Mobile Java Debug Tool

  • Author

    Feng, Degui ; Chen, Jian ; Yan, Like ; Wu, Binbin ; Lou, Xueqing ; Chen, Tianzhou

  • Author_Institution
    Coll. of Comput. Sci., Zhejiang Univ., Hangzhou, China
  • fYear
    2009
  • fDate
    25-27 Sept. 2009
  • Firstpage
    109
  • Lastpage
    114
  • Abstract
    As the handsets integrated the J2ME environment is increasing in recent time. After PhoneME which is one implementation of the J2ME had become an open project, transplanting it to many different platforms become a hotspot for some time. There are some implementations for the online debugging between the PC and specific embedded device. But there isn´t a well-designed architecture for the debugging processes between the PC and the mobile phone, there just some assistance tools for co-debug. As the mobile phone industry developing, there are many smart phones with affluent hardware resource. This makes the co-debug between PC and smart mobile phone become possible. In this paper, we present a debug framework for the Java application development platform across the PC and mobile phone. With this framework, we can develop the MIDlets for specific embedded device more convenient.
  • Keywords
    Java; embedded systems; mobile computing; program debugging; software tools; J2ME environment; Java application development platform; MIDlets; PhoneME; embedded device; mobile Java debug tool; mobile phone industry; online debugging; smart mobile phone; Application software; Debugging; Embedded computing; Hardware; Java; Mobile communication; Mobile handsets; Protocols; Smart phones; Wire; Co-debug; Debug Agent; Debuggee; Debugger; JDWP; KDWP; PhoneME;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Scalable Computing and Communications; Eighth International Conference on Embedded Computing, 2009. SCALCOM-EMBEDDEDCOM'09. International Conference on
  • Conference_Location
    Dalian
  • Print_ISBN
    978-0-7695-3825-9
  • Type

    conf

  • DOI
    10.1109/EmbeddedCom-ScalCom.2009.29
  • Filename
    5341588