DocumentCode :
2511070
Title :
Module-level characterization for vehicle-level emissions modeling
Author :
Hubing, Todd H.
Author_Institution :
Int. Center for Automotive Res., Clemson Univ., Greenville, SC, USA
fYear :
2010
fDate :
12-16 April 2010
Firstpage :
680
Lastpage :
682
Abstract :
Automotive components are subjected to a variety of electromagnetic compatibility tests before they are ever installed on a vehicle, and yet the correlation between component-level EMC test results and vehicle-level EMC performance is generally poor. As automobiles become more reliant on electronic systems to ensure the reliable operation of the vehicle and the safety of its occupants, full-vehicle electromagnetic simulations are becoming an increasingly important part of the automotive design process. These simulations require accurate models for the various electronic modules found in the vehicle. CISPR 25 measurements do not yield sufficient information to be useful in full-vehicle simulations. New test procedures are required to characterize automotive modules as electromagnetic sources. Source models derived from these tests can then be used in vehicle-level electromagnetic simulations for the purpose of determining the optimum design and placement of electronic modules and wiring harnesses in the vehicle.
Keywords :
automotive components; automotive electronics; electromagnetic compatibility; vehicles; CISPR 25 measurement; automobile; automotive components; automotive design process; component-level EMC test; electromagnetic compatibility test; full-vehicle electromagnetic simulation; module-level characterization; vehicle-level EMC performance; vehicle-level emissions modeling; Automobiles; Automotive components; Automotive engineering; Electromagnetic compatibility; Electromagnetic measurements; Electromagnetic modeling; Electronic equipment testing; Process design; Vehicle safety; Wiring;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility (APEMC), 2010 Asia-Pacific Symposium on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-5621-5
Type :
conf
DOI :
10.1109/APEMC.2010.5475540
Filename :
5475540
Link To Document :
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