• DocumentCode
    2511100
  • Title

    Compact LTCC module for WLAN RF front-end

  • Author

    Zhu, Li-Zheng ; Wei, Xu-Bo ; Wang, Peng ; Ma, Song ; Zeng, Zhi-Yi ; Yang, Bang-Chao

  • Author_Institution
    Res. Inst. of Electron. Sci. & Technol., Univ. of Electron. Sci. & Technol. of China, Chengdu, China
  • fYear
    2011
  • fDate
    21-23 Oct. 2011
  • Firstpage
    387
  • Lastpage
    389
  • Abstract
    In this paper, a low-temperature co-fired ceramic (LTCC) module for Wireless Local Area Network (WLAN) RF front-end is proposed. The module integrates an embedded band pass filter, an embedded lumped element Wilkinson power divider, and embedded LTCC inductors and capacitors, in a single LTCC package. The circuit is separated into low-frequency circuit part and high frequency circuit part. By integrating these miniature passive component designs, using the three-dimensional multichip module multichip module (3D-MCM) technique, the proposed module features a compact size of 20mm×20mm×5mm. The measurement results show that the application meets the current electrical specification requirements of the wireless communication system compatible with IEEE802.11b/g.
  • Keywords
    band-pass filters; ceramic packaging; power dividers; wireless LAN; 3D-MCM technique; LTCC capacitor; LTCC inductor; LTCC package; WLAN RF front-end; band pass filter; compact LTCC module; low-temperature cofired ceramic; lumped element Wilkinson power divider; miniature passive component design; three-dimensional multichip module multichip module; wireless local area network; Band pass filters; Inductors; Microwave amplifiers; Power amplifiers; Power dividers; Substrates; Wireless LAN;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computational Problem-Solving (ICCP), 2011 International Conference on
  • Conference_Location
    Chengdu
  • Print_ISBN
    978-1-4577-0602-8
  • Electronic_ISBN
    978-1-4577-0601-1
  • Type

    conf

  • DOI
    10.1109/ICCPS.2011.6092238
  • Filename
    6092238