Title :
Statistical analysis of power module thermal test equipment performance
Author :
Houf, Robert E. ; Berman, David B.
Author_Institution :
Allen-Bradley Co. Inc., Milwaukee, WI, USA
Abstract :
A computer-based system for determining the thermal resistance of power semiconductor modules was developed and characterized for precision by the gage study method. Results are presented to illustrate the usefulness of this statistical method for determining the measuring capability of the system. The method provides a means for demonstrating vendor/customer test capability which can reduce potential sources of conflict in part acceptance-testing
Keywords :
automatic test equipment; modules; semiconductor device testing; statistical analysis; thermal resistance measurement; thyristor applications; ATE; acceptance-testing; gage study method; power module thermal test equipment; power semiconductor modules; statistical method; thermal resistance; Electronic packaging thermal management; Heat engines; Heat sinks; Multichip modules; Semiconductor device packaging; Statistical analysis; Test equipment; Thermal resistance; Thyristors; Water heating;
Conference_Titel :
Semiconductor Thermal and Temperature Measurement Symposium, 1988. SEMI-THERM IV., Fourth Annual IEEE
Conference_Location :
San Diego, CA
DOI :
10.1109/SEMTHE.1988.10593
