DocumentCode
2511186
Title
Statistical analysis of power module thermal test equipment performance
Author
Houf, Robert E. ; Berman, David B.
Author_Institution
Allen-Bradley Co. Inc., Milwaukee, WI, USA
fYear
1988
fDate
10-12 Feb 1988
Firstpage
25
Lastpage
29
Abstract
A computer-based system for determining the thermal resistance of power semiconductor modules was developed and characterized for precision by the gage study method. Results are presented to illustrate the usefulness of this statistical method for determining the measuring capability of the system. The method provides a means for demonstrating vendor/customer test capability which can reduce potential sources of conflict in part acceptance-testing
Keywords
automatic test equipment; modules; semiconductor device testing; statistical analysis; thermal resistance measurement; thyristor applications; ATE; acceptance-testing; gage study method; power module thermal test equipment; power semiconductor modules; statistical method; thermal resistance; Electronic packaging thermal management; Heat engines; Heat sinks; Multichip modules; Semiconductor device packaging; Statistical analysis; Test equipment; Thermal resistance; Thyristors; Water heating;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal and Temperature Measurement Symposium, 1988. SEMI-THERM IV., Fourth Annual IEEE
Conference_Location
San Diego, CA
Type
conf
DOI
10.1109/SEMTHE.1988.10593
Filename
10593
Link To Document