DocumentCode
2511312
Title
A LTCC cavity filter for MMW transceiver module application
Author
Xu, Z.Q. ; Xia, H. ; Wang, P. ; Wei, X.B. ; Jin, L.
Author_Institution
Univ. of Electron. Sci. & Technol. of China, Chengdu, China
fYear
2011
fDate
21-23 Oct. 2011
Firstpage
627
Lastpage
630
Abstract
A compact cavity filter using multilayer Low Temperature Co-fired Ceramic (LTCC) technology is proposed for millimetre-wave (MMW) transceiver module application. According to full-wave electro-magnetic (EM) comparing simulation, the length and the width of filter´s structure has been determined by optimizing and extracting quality factor and coupling coefficient of the cavity resonators. A Ka-band cavity filter of the proposed prototype is fabricated and measured. Measurement results show good performance and agree with EM full wave simulation. The minimum measured insertion loss is 2.21 dB at 34.4 GHz, and return loss is lower than 18 dB over the passband. The size of the filter is only 8.5 mm×3.2 mm×1.2 mm including microstrips I/O ports and via fences structure. The cavity filter exhibits advantages of small size and high reliability compared to conventional planar filter structure, which makes it suitable for MMW wireless communication applications.
Keywords
band-pass filters; cavity resonator filters; ceramics; microstrip filters; millimetre wave filters; radio transceivers; EM comparing simulation; EM full wave simulation; Ka-band cavity filter; LTCC cavity filter; LTCC technology; MMW transceiver module application; MMW wireless communication applications; cavity resonators; compact cavity filter; coupling coefficient; fences structure; full-wave electromagnetic comparing simulation; loss 2.21 dB; measured insertion loss; microstrips I/O ports; millimetre-wave tranceiver module application; multilayer low temperature co-fired ceramic technology; passband; planar filter structure; quality factor; Band pass filters; Cavity resonators; Couplings; Dielectric measurements; Frequency measurement; Microwave filters; Resonator filters;
fLanguage
English
Publisher
ieee
Conference_Titel
Computational Problem-Solving (ICCP), 2011 International Conference on
Conference_Location
Chengdu
Print_ISBN
978-1-4577-0602-8
Electronic_ISBN
978-1-4577-0601-1
Type
conf
DOI
10.1109/ICCPS.2011.6092251
Filename
6092251
Link To Document