• DocumentCode
    2511399
  • Title

    Analysis of mobile phone´s immunity to electrostatic discharge soft failures

  • Author

    Kwon, Soon Jae ; Kim, Ki Hyuk ; Yongsup Kim ; Kim, Austin S.

  • Author_Institution
    Adv. CAE Lab., Samsung Electron. Co., Ltd., Suwon, South Korea
  • fYear
    2010
  • fDate
    12-16 April 2010
  • Firstpage
    68
  • Lastpage
    71
  • Abstract
    A technique for the analysis of mobile phone´s immunity to the electrostatic discharge (ESD) soft failures is proposed. First, a mobile phone, ESD simulator and ESD testing setup are modelled and then the simulation is performed using time-domain full-wave electromagnetic simulator. The proposed technique is applied to the analysis of ESD soft failure of mobile phones and the root causes of the ESD soft failure are investigated. ESD voltages obtained from simulation are compared to that from measurement. Also, improvement in the frequency of occurrence of ESD soft failure by the application of countermeasures derived from ESD simulation result is presented.
  • Keywords
    electrostatic discharge; failure analysis; immunity testing; mobile handsets; time-domain analysis; ESD simulator; ESD testing setup; ESD voltage; electrostatic discharge soft failure; mobile phone; time-domain full-wave electromagnetic simulator; Electromagnetic measurements; Electromagnetic modeling; Electrostatic analysis; Electrostatic discharge; Failure analysis; Mobile handsets; Performance evaluation; Testing; Time domain analysis; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility (APEMC), 2010 Asia-Pacific Symposium on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-5621-5
  • Type

    conf

  • DOI
    10.1109/APEMC.2010.5475557
  • Filename
    5475557