DocumentCode
2511399
Title
Analysis of mobile phone´s immunity to electrostatic discharge soft failures
Author
Kwon, Soon Jae ; Kim, Ki Hyuk ; Yongsup Kim ; Kim, Austin S.
Author_Institution
Adv. CAE Lab., Samsung Electron. Co., Ltd., Suwon, South Korea
fYear
2010
fDate
12-16 April 2010
Firstpage
68
Lastpage
71
Abstract
A technique for the analysis of mobile phone´s immunity to the electrostatic discharge (ESD) soft failures is proposed. First, a mobile phone, ESD simulator and ESD testing setup are modelled and then the simulation is performed using time-domain full-wave electromagnetic simulator. The proposed technique is applied to the analysis of ESD soft failure of mobile phones and the root causes of the ESD soft failure are investigated. ESD voltages obtained from simulation are compared to that from measurement. Also, improvement in the frequency of occurrence of ESD soft failure by the application of countermeasures derived from ESD simulation result is presented.
Keywords
electrostatic discharge; failure analysis; immunity testing; mobile handsets; time-domain analysis; ESD simulator; ESD testing setup; ESD voltage; electrostatic discharge soft failure; mobile phone; time-domain full-wave electromagnetic simulator; Electromagnetic measurements; Electromagnetic modeling; Electrostatic analysis; Electrostatic discharge; Failure analysis; Mobile handsets; Performance evaluation; Testing; Time domain analysis; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility (APEMC), 2010 Asia-Pacific Symposium on
Conference_Location
Beijing
Print_ISBN
978-1-4244-5621-5
Type
conf
DOI
10.1109/APEMC.2010.5475557
Filename
5475557
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