Title :
A Fast Elliptic Curve Based Key Agreement Protocol-on-Chip (PoC) for Securing Networked Embedded Systems
Author :
Duraisamy, Roshan ; Salcic, Zoran ; Morales-Sandoval, Miguel ; Feregrino-Uribe, Claudia
Author_Institution :
Dept. of Electr. & Comput. Eng., Auckland Univ.
Abstract :
Securing communication sessions between networked embedded systems is a major challenge that needs to be addressed as an increasing number of such systems become Internet-enabled. Securely and quickly establishing a session key between communicating nodes in a network requires authentication of node identities. In this paper, we propose a simple elliptic-curve based key negotiation protocol suitable for fully hardware implementation as a protocol on chip (PoC). The protocol uses the elliptic curve variants of both the Diffie Hellmann exchange and the digital signature algorithm. Timing results demonstrate that an end-to-end protocol run can be performed in as little as 28ms on a 25MHz clock, which is several times faster than previous microprocessor-based implementations of similar protocols. The results indicate that session keys can thereby have shorter lifetimes, since there is little computational overhead in re-generating them, thus enhancing overall security of the networked embedded systems
Keywords :
Internet; digital signatures; embedded systems; network-on-chip; protocols; public key cryptography; telecommunication security; Diffie Hellmann exchange; Internet; PoC; digital signature algorithm; elliptic curve based key agreement protocol-on-chip; elliptic-curve based key negotiation protocol; message authentication; microprocessor-based implementation; networked embedded system security; session key; Authentication; Clocks; Computer networks; Digital signatures; Elliptic curves; Embedded system; Hardware; IP networks; Protocols; Timing;
Conference_Titel :
Embedded and Real-Time Computing Systems and Applications, 2006. Proceedings. 12th IEEE International Conference on
Conference_Location :
Sydney, Qld.
Print_ISBN :
0-7695-2676-4
DOI :
10.1109/RTCSA.2006.6