Title :
Rapid prototyping of multichip packages using computer-controlled, ink jet direct-write
Author :
Teng, K.F. ; Azadpour, M.A. ; Yang, H.Y.
Author_Institution :
Dept. of Electr. Eng., Mississippi State Univ., MS, USA
Abstract :
A preliminary study is described that shows the feasibility of rapid prototyping for the multichip packages. This can ease the prototyping bottleneck in the multichip packaging process. A model of the ink-jet direct-write system was developed, and various inks were studied. It was found that liquid photoresist inks have the most promise. Well-defined interconnection patterns among chips can be obtained by writing the photoresist inks directly on metal-coated substrates and following with a metal film etching method. Conductive metal lines of 2 mil. in width or smaller can be achieved
Keywords :
hybrid integrated circuits; process computer control; thick film circuits; 2 mil; computer controlled direct write; feasibility; ink-jet direct-write system; interconnection patterns; liquid photoresist inks; metal film etching method; metal lines; metal-coated substrates; multichip packages; rapid prototyping; Foundries; Ink; Integrated circuit interconnections; Laboratories; Microelectronics; Packaging; Printing; Prototypes; Resists; Voltage control;
Conference_Titel :
Electronics Components Conference, 1988., Proceedings of the 38th
Conference_Location :
Los Angeles, CA
DOI :
10.1109/ECC.1988.12612
