• DocumentCode
    2512522
  • Title

    Effect of surface flatness on interface heat transfer

  • Author

    Zwick, J.W.

  • Author_Institution
    Hughes Aircraft Co., Tucson, AZ, USA
  • fYear
    1988
  • fDate
    10-12 Feb 1988
  • Firstpage
    88
  • Lastpage
    95
  • Abstract
    Data and conclusions are presented on the effect of surface flatness on heat transfer across an interface between two plates. The effect of thermal grease (Dow Corning 340 silicone heat sink compound) on interface heat transfer is also presented. Test data yields three conclusions: interface heat transfer varies linearly over the tested range of surface flatness (0.010 to 0.035 in); thermal grease decreases interface thermal resistance by a minimum factor of 2.5; and as interface temperature increases, thermal resistance decreases. The objective of the thermal tests was to measure the rate of heat transfer across an aluminum-to-aluminum interface. The subject interface is located between two electronics assemblies
  • Keywords
    heat sinks; heat transfer; packaging; thermal variables measurement; Al-Al; Dow Corning 340 silicone heat sink compound; electronics assemblies; interface heat transfer; interface temperature; packaging; surface flatness; thermal grease; thermal resistance; thermal tests; Assembly; Electrical resistance measurement; Heat sinks; Heat transfer; Resistance heating; Surface resistance; Temperature distribution; Testing; Thermal factors; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal and Temperature Measurement Symposium, 1988. SEMI-THERM IV., Fourth Annual IEEE
  • Conference_Location
    San Diego, CA
  • Type

    conf

  • DOI
    10.1109/SEMTHE.1988.10603
  • Filename
    10603