Title :
Thermal analysis of microwave integrated circuits using a high resolution infrared imaging system
Author :
Semon, W. ; Monks, William
Author_Institution :
Loral TerraCom, San Diego, CA, USA
Abstract :
Summary form only given. A high-resolution infrared imaging system (IRIS) used to analyze the temperature within a microwave integrated circuit (MIC) is reported. The system is used to assess the accuracy of thermal analyses of MICs. Data taken from an MIC transmitter, consisting of several subassemblies and containing heat-generating and heat-dissipating components, were compared to predicted performance for both active devices and other power-dissipating components in the MIC. Performance of the IRIS was verified by measuring the temperature of the MIC´s bipolar transistor in the voltage-controlled oscillator (VCO) and of the field-effect transistor (FET) in the small-signal amplifier. The data showed unexpected heat dissipation from varactor diodes mounted on an alumina substrate in the VCO.<>
Keywords :
bipolar integrated circuits; field effect integrated circuits; heat sinks; infrared imaging; microwave amplifiers; microwave integrated circuits; packaging; temperature measurement; varactors; variable-frequency oscillators; AlO/sub 2/; IR; IRIS; active devices; bipolar transistor; field-effect transistor; heat generating components; heat-dissipating components; infrared imaging; microwave integrated circuits; power-dissipating components; small-signal amplifier; transmitter; varactor diodes; voltage-controlled oscillator; Electromagnetic heating; FETs; Image analysis; Infrared imaging; Microwave devices; Microwave integrated circuits; Temperature; Transmitters; Voltage-controlled oscillators;
Conference_Titel :
Semiconductor Thermal and Temperature Measurement Symposium, 1988. SEMI-THERM IV., Fourth Annual IEEE
Conference_Location :
San Diego, CA, USA
DOI :
10.1109/SEMTHE.1988.10604
