DocumentCode
2512579
Title
Chip-scale DC/DC power converter
Author
Shenai, Krishna ; Bernstein, Gary H. ; Xing, Huili Grace ; Wu, Jie
Author_Institution
Dept. of Electr. & Comput. Eng., Univ. of Toledo, Toledo, OH, USA
fYear
2010
fDate
14-16 July 2010
Firstpage
310
Lastpage
316
Abstract
The design of disruptive chip-scale integration of DC/DC power converters using breakthrough silicon and GaN power semiconductor switching devices, silicon CMOS control IC, MEMS inductor and microchip supercapacitor assembled using novel “Quilt Packaging” and microcooling to achieve nearly 90% power conversion efficiency is reported.
Keywords
CMOS integrated circuits; DC-DC power convertors; III-V semiconductors; chip scale packaging; elemental semiconductors; gallium compounds; inductors; micromechanical devices; power semiconductor switches; silicon; supercapacitors; wide band gap semiconductors; GaN; GaN power semiconductor switching device; MEMS inductor; chip-scale DC-DC power converter; chip-scale integration; microchip supercapacitor; microcooling; quilt packaging; silicon; silicon CMOS control IC; Capacitors; Converters; Gallium nitride; Inductors; Logic gates; Silicon; Substrates; DC-to-DC Converter; GaN FET; Quilt Packaging; integrated inductor; microcooler;
fLanguage
English
Publisher
ieee
Conference_Titel
Aerospace and Electronics Conference (NAECON), Proceedings of the IEEE 2010 National
Conference_Location
Fairborn, OH
ISSN
0547-3578
Print_ISBN
978-1-4244-6576-7
Type
conf
DOI
10.1109/NAECON.2010.5712969
Filename
5712969
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