• DocumentCode
    2512583
  • Title

    A finite element thermal analysis program for square shaped packages and subsequent experimental comparisons

  • Author

    Wilson, E.A.

  • Author_Institution
    Honeywell Inc., Phoenix, AZ, USA
  • fYear
    1988
  • fDate
    10-12 Feb 1988
  • Firstpage
    101
  • Lastpage
    104
  • Abstract
    A finite-element thermal analysis program is presented. A description of the finite element used in the program is provided along with an explanation of the matrix storage scheme and simultaneous equation solution which significantly reduces memory requirements. A specific model of a real package is given along with a discussion of the development of realistic convection boundary conditions. A comparison with subsequent experimental results shows that this simple-to-use program, which can run on a personal computer, can predict junction-to-air resistances within 10% of the measured value
  • Keywords
    convection; cooling; electronic engineering computing; finite element analysis; heat sinks; matrix algebra; packaging; convection boundary conditions; electronic engineering computing; finite element thermal analysis; junction-to-air resistances; matrix storage; personal computer; simultaneous equation solution; square shaped packages; Bandwidth; Boundary conditions; Electrical resistance measurement; Equations; Finite element methods; Microcomputers; Packaging; Predictive models; Shape; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal and Temperature Measurement Symposium, 1988. SEMI-THERM IV., Fourth Annual IEEE
  • Conference_Location
    San Diego, CA
  • Type

    conf

  • DOI
    10.1109/SEMTHE.1988.10608
  • Filename
    10608