Title :
Cumulative bibliography of articles on semiconductor thermal and temperature testing
Author_Institution :
Sage Enterprises Inc., Mountain View, CA, USA
Abstract :
The bibliography given contains both journal and conference items, from as early as 1968, but primarily from 1980 to the present. All the entries listed in the bibliography provide information on semiconductor thermal and/or temperature characteristics, measurement techniques and results, hardware applications, and other pertinent information
Keywords :
heat sinks; integrated circuit testing; packaging; semiconductor device testing; temperature measurement; thermal variables measurement; bibliography; semiconductor thermal characteristics; temperature characteristics; temperature testing; Bibliographies; Electronic packaging thermal management; Integrated circuit packaging; Microscopy; Plastics; Semiconductor device testing; Temperature measurement; Thermal management of electronics; Thermal stresses; Very large scale integration;
Conference_Titel :
Semiconductor Thermal and Temperature Measurement Symposium, 1988. SEMI-THERM IV., Fourth Annual IEEE
Conference_Location :
San Diego, CA
DOI :
10.1109/SEMTHE.1988.10615
