Title :
Improved triaxial set-ups for the measurement of complex transfer impedances and admittances of shielded multiconductor cables inside cable bundles
Author :
Jung, Lorenz ; Ter Haseborg, Jan Luiken
Author_Institution :
Dept. of Meas. Eng. & Electromagn. Compatibility, Tech. Univ. Hamburg-Harburg, Germany
Abstract :
The determination of the complex transfer impedances and transfer admittances of shielded multiconductor cables is the prerequisite for calculating the disturbing currents on the inner wires of the cable. With a measurement procedure based on the triaxial measurement set-ups using multiconductor transmission line theory for evaluation, it is possible to determine individual transfer impedances and admittances for each inner conductor of a single shielded multiconductor cable over a broad frequency range. This paper shows a first attempt to measure transfer impedances of cables that are located in cable bundles with a modified measurement set-up that is based on the measurement set-up for single cables. As soon as some emerged problems, which are also apparent in a real world environment, have been solved, it should be possible to carry out precise transfer impedance and admittance measurements on cables that are located in cable bundles
Keywords :
cable shielding; cable testing; electric admittance measurement; electric impedance measurement; electromagnetic shielding; multiconductor transmission lines; transmission line theory; EMI; cable bundles; complex transfer admittance measurement; complex transfer impedance measurement; disturbing currents; inner wires; measurement procedure; modified measurement set-up; multiconductor transmission line theory; shielded multiconductor cables; triaxial measurement set-ups; Admittance; Communication cables; Conductors; Electromagnetic measurements; Equivalent circuits; Impedance measurement; Multiconductor transmission lines; Transmission line measurements; Voltage; Wires;
Conference_Titel :
Electromagnetic Compatibility, 2000. IEEE International Symposium on
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-5677-2
DOI :
10.1109/ISEMC.2000.875534