• DocumentCode
    2513355
  • Title

    High frequency performance, measurement and modelling of simple mechanical ground contacts used in mobile phones

  • Author

    White, Andy

  • Author_Institution
    Nokia Corp., San Diego, CA, USA
  • fYear
    2010
  • fDate
    12-16 April 2010
  • Firstpage
    60
  • Lastpage
    63
  • Abstract
    In this paper a test method is proposed to assess the performance, characterise, measure and then model the high frequency impedance of simple mechanical ground contacts that are used within mobile phones. A simple test fixture is defined that allows the ground contact attenuation performance between 2 ports to be measured over a wide frequency range. A simulation model for the test fixture and ground contact is modelled using a 3D EM simulation solver. The 3D model for the ground contact contains variable parameters that can be adjusted for each type of ground contact used within the test fixture. A comparison and good correlation between the 3D EM solver results and the actual test fixture results is completed. The test fixture allows varying mechanical ground contacts [design, material etc] to be evaluated and the simulation allows a 3D model of the mechanical ground contact to be modelled which can then be utilised in full phone 3D EM simulations.
  • Keywords
    mechanical contact; mobile handsets; 3D EM simulation solver; ground contact attenuation; high frequency impedance modelling; mechanical ground contact modelling; mobile phones; test fixture simulation model; Attenuation measurement; Conductors; Electromagnetic modeling; Fixtures; Frequency measurement; Impedance measurement; Mechanical variables measurement; Mobile handsets; Steel; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility (APEMC), 2010 Asia-Pacific Symposium on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-5621-5
  • Type

    conf

  • DOI
    10.1109/APEMC.2010.5475659
  • Filename
    5475659