Title :
Ground starvation effects on multi-layer PCBs
Author :
Sullivan, Cornelius O. ; Lee, Norman
Author_Institution :
Cisco Syst. Inc., San Jose, CA, USA
Abstract :
Ground starvation on multi-layer printed circuit boards is common due to the popular use of high pin count ball grid arrays (BGAs), multi-pin connectors and numerous other devices and technologies. The effects on crosstalk, characteristic impedance and power bus performance of such high density arrays of via keep-out holes in the signal return or reference planes are investigated
Keywords :
application specific integrated circuits; crosstalk; earthing; electric connectors; electric impedance; electromagnetic interference; printed circuits; ASIC; EMI control; EMI performance; ball grid arrays; characteristic impedance; crosstalk; ground starvation effects; high density arrays; high pin count BGA; keep-out holes; measurements; multi-pin connectors; multilayer PCBs; multilayer printed circuit boards; power bus performance; reference planes; signal integrity; signal return; Capacitance; Connectors; Crosstalk; Impedance; Inductance; Printed circuits; Routing; Solids; Switching circuits; Testing;
Conference_Titel :
Electromagnetic Compatibility, 2000. IEEE International Symposium on
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-5677-2
DOI :
10.1109/ISEMC.2000.875547
